document.write('  2012q??日,推进利用TSV(通孔)的三l层叠型C代DRAM“HybridMemoryCube(HMC)”普及的HybridMemoryCubeConsortium(HMCC)宣布QY件行业巨头美国微软已加盟该协会。  HMC是采用三l构造,在逻辑芯片上沿垂直方向叠加多个DRAM芯片Q?);
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